产品用途: 
	应用于高温环境中的触摸屏面板(TSP)和结构组件。
	Application: 
	They are mainly used in touch screen panels (TSPs) and structural assemblies in high temperature environments.
	 
	产品性能参数/Product Property Parameters: 
	
	 
	其他性能Other Properties: 
	
		
			| 
					牌号 
				 
					Grade 
				 | 
					密度 
				 
					Density 
				 
					(g/cm3) 
				 | 
					平均晶粒尺寸Average Grain Size (μm) 
				 | 
					粗糙度Roughness 
				 
					(μm) 
				 | 
					直线度Straightness (mm) 
				 | 
					贴合率Bonding Rate 
				 | 
		
			| 
					MoNb5 
				 | 
					≥10.00 
				 | 
					≤100 
				 | 
					≤0.8 
				 | 
					≤0.30 
				 | 
					≥97% 
				 | 
		
			| 
					MoNb10 
				 | 
					≥9.90 
				 | 
					≤100 
				 | 
					≤0.8 
				 | 
					≤0.30 
				 | 
					≥97% 
				 | 
	
	  
	注:如有特殊要求,双方具体商定。 
	Note: Special requirements will be agreed upon by the supplier and buyer.